The EMC Society Podcast: Hear Us Above the Noise
CROSSTALK, The EMC Society Podcast: Hear Us Above the Noise. The IEEE EMC Society Podcast discussing interesting topics on electromagnetic compatibility (EMC), signal integrity (SI), and power integrity (PI) for our technical community. The IEEE EMC Society is the world's largest organization dedicated to the development and distribution of information, tools and techniques for reducing electromagnetic interference. The society's fields of interest includes standards, measurement techniques, test procedures, instrumentation, equipment and systems characteristics, interference control techniques and components, education, computational analysis, and spectrum management, along with scientific, technical, industrial, professional, or other activities that contribute to these fields.
The EMC Society Podcast: Hear Us Above the Noise
#24 CROSSTALK - IEEE EMC Society Podcast - 2022 - DongHyun Bill Kim: Inhomogeneous Dielectric Materials of PCB – Dk,Df Extraction and It’s Impact on Crosstalk
Welcome to the CROSSTALK - the IEEE EMC Society Podcast. Hear us above the Noise!
The Podcast to discuss interesting topics on electromagnetic compatibility to our technical community.
In this issue we will talk with DongHyun Bill Kim.
Bill is assistant professor of electrical and computer engineering at Missouri University of Science and Technology, Rolla and will talk about Inhomogeneous Dielectric Materials of PCB – Dk,Df Extraction and It’s Impact on Crosstalk.
Bio of the speaker:
DongHyun (Bill) Kim received B.S., M.S. and Ph.D. degrees in electrical engineering from Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea, in 2012, 2014 and 2018, respectively. In 2018, he joined the Missouri University of Science and Technology (formerly University of Missouri-Rolla), Rolla, MO, USA, and is currently an Assistant Professor with the Missouri S&T EMC Laboratory, Rolla, MO, USA.
His current research interests include nanometer-scale devices, through-silicon via (TSV) technology, dielectric material characterization and signal integrity (SI), power integrity (PI), temperature integrity (TI), electromagnetic compatibility (EMC) and electrostatic discharge (ESD) in 2.5D/3D IC systems.
He is a recipient of the IEEE Region 5 Outstanding Young Professional (formerly GOLD) Award, IEEE St. Louis Section Outstanding Young Engineer Award and DesignCon Best Paper Award. He is a co-recipient of the DesignCon Early Career Best Paper Awards and IEEE EMC Symposium Best SIPI Symposium Paper Award and Best SIPI Student Paper Awards. He is currently the vice chair or IEEE St. Louis Section, and the vice chair of the IEEE EMC Society TC-10 (Signal Integrity and Power Integrity).
References:
- S. Yong, V. Khilkevich, X. Cai, C. Sui, B. Sen, J. Fan, ‘A Comprehensive and Practical Way to Look at Far-End Crosstalk for Transmission Lines with Lossy Conductor and Dielectric ’, IEEE Trans-EMC
- Y. Liu, et al., " Far-End Crosstalk Analysis for Stripline with Inhomogeneous Dielectric Layers (IDL)”, 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021, pp. 825-830.
- Y. Liu, S. Yong, Y. Guo, J. He, C. Li, X. Ye, J. Fan, V. Khilkevich, D. Kim, "An Empirical Modeling of Far-end Crosstalk and Insertion Loss in Microstrip Lines", conditional accepted to IEEE Transactions on Signal and Power Integrity.
- Y. Liu, S. Yong, Y. Guo, J. He, C. Li, X. Ye, J. Fan, D. Kim, "Far-end Crosstalk Modeling and Prediction for Stripline with Inhomogeneous Dielectric Layers (IDLs) ", conditional accepted to IEEE Transactions on Signal and Power Integrity.
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